On February 22, Huacan Optoelectronics (referred to as "the company") announced the signing of the "Huacan Optoelectronics Advanced Semiconductor and Device Project Investment Framework Agreement." This agreement marks the company's commitment to invest in the development of advanced semiconductor and device projects within the Yiwu Information Optoelectronics High-tech Industrial Park. The Yiwu Municipal People’s Government served as a witness to the signing.
According to the official announcement, the project will cover multiple key areas, including LED epitaxial and chip production, sapphire substrates, ultraviolet LEDs, infrared LEDs, microLEDs, MEMS sensors, vertical cavity surface emitting lasers (VCSELs), gallium nitride (GaN)-based lasers, and GaN-based power electronics. The total planned investment for this ambitious initiative is RMB 10.8 billion. The project will require approximately 500 mu of land, with an expected construction period of seven years.
The company stated that the agreement aligns with its long-term strategic goals, aiming to expand its future growth potential and strengthen its competitive position in the industry. Successful execution of the project is expected to support the company’s business expansion, provide a solid foundation for sustainable development, and enhance its core capabilities through accumulated experience in project implementation and management.
Furthermore, the company emphasized that the agreement will not have a significant impact on its 2018 financial performance, including operating income and net profit. However, the long-term financial benefits remain uncertain and will depend on the project's progress and market conditions.
This major move highlights Huacan Optoelectronics' growing presence in the high-tech semiconductor sector and its commitment to innovation and technological advancement. With this new project, the company is positioning itself to play a more prominent role in the global optoelectronics and semiconductor industries.
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