This change is especially evident this year. In the past few years, only manufacturers with flip-chip technology as technology reserves, such as Ronda, Jingdian, and cross-strait optoelectronics, have launched new products based on flip chip technology, which further confirms the spring market of flip chip. . In 2014, LED flip chip technology is prevalent. Its technical performance advantages and future market prospects will be more and more concerned by chips and packaging manufacturers, which will accelerate the LED packaging revolution.
Flip chip development
Flip chip originated in the 1960s and was first developed by IBM to be applied to IC and some semiconductor products. The specific principle is to deposit tin shots on I/Opad, then flip the chip to heat using molten tin. The combination of shot put and ceramic board, this technology has replaced the conventional wire bonding, and has gradually become the trend of future packaging.
tips:
Positive chip: The earliest chip structure is also the chip structure commonly used in small power chips. In this structure, the electrode is on top, and the material from top to bottom is: P-GaN, luminescent layer, N-GaN, substrate. Therefore, it is a formal dress compared to flipping;
Flip-chip: In order to avoid the effect of the electrode on the LED in the pre-loaded chip and affect the luminous efficiency, the chip developer designed the flip-chip structure, that is, the flip-chip is inverted, so that the light excited by the luminescent layer is directly emitted from the other side of the electrode. The bottom is finally stripped, the chip material is transparent), and at the same time, the structure of the LED package factory wire bond is designed for the flip chip. Therefore, the whole chip is called a flip chip, and the structure is currently in a high power chip. More used.
Especially after the flip chip is applied in the field of LED packaging, the flip chip process has five distinct advantages compared to the conventional packaged chip. Deng Qiai, project manager of the two-storied optoelectronic flip chip, believes. First, after the flip-chip, the electrode directly contacts the heat-dissipating substrate, and does not pass through the sapphire heat dissipation, and can be used with a large current; the second is that the size can be made smaller, the optical is easier to match; the third is that the heat dissipation function is improved, and the life of the chip is extended; Wire the line to avoid the risk of disconnection; the fifth is to lay the foundation for the subsequent development of packaging process.
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