[Text|High-tech LED reporter Xiong Yuheng] From the perspective of scale, Hongli Optoelectronics is not the largest in the domestic packaging field, but its profitability is far behind the industry peers. According to the midday announcement released by Hongli Optoelectronics on October 14, the company expects net profit attributable to shareholders of listed companies in the first three quarters, which is 40%-60% higher than the same period of last year, and realized a profit of 51.066 million yuan - 5.88.4077 million yuan.
In the context of the industry's generally dilute profits in the packaging industry, it is not easy for Hongli Optoelectronics to achieve such results. "LED packaging is the core business of Hongli, especially in the field of white light devices." Liu Yusheng, executive vice president of Hongli Optoelectronics, said that although the overall packaging capacity of Hongli is not the largest in the industry, in terms of high-end white light devices, the scale should be domestic. The biggest.
The relevant data also shows that in 2013, the revenue of Hongli Optoelectronics packaging business exceeded the 500 million yuan mark, and the revenue of white light packaging business accounted for 421 million yuan, and the advantages of its white-light packaged devices are very obvious.
In October of this year, Hongli Optoelectronics spent a total of 170 million yuan to acquire a 100% stake in Smect. Hongli Optoelectronics not only acquired the high-quality assets and management team of Smex, but also cooperated with Sima in technology, customers and sales channels. They must complement each other and exert synergy to establish their leading position in the field of white light packaging.
Earlier in August, Hongli Optoelectronics announced that it had invested 1 billion yuan to establish an industrial park in Nanchang, which is mainly used for research and development, production and sales of LED packaging devices and LED lighting applications. The construction of this industrial base is self-evident for Hongli Optoelectronics to expand its production capacity, improve the cost performance of its products, and enhance its competitiveness and profitability.
In addition, Hongli Optoelectronics is also actively expanding its business areas to seek new profit growth points. In addition to strategic cooperation with Qingdao Jiesheng in June to enter the UV UV-LED market, Hongli Optoelectronics has achieved very good results in many key packaging technologies such as SMD, backlight devices, high-power devices, COB, and flip-chip packages. Results.
In recent years, the concept of flip-chip devices has been heated up, and Hongli Optoelectronics has also invested in it. In the 2014 High-tech LED Golden Globe Awards (5th), Hongli Optoelectronics relied on the X-CHIP high-heat-conducting small-size ceramic series flip-chip device to force the finalists into the top three. , Jingke Electronics) won the Golden Globe Award trophy for flip-chip devices.
According to Wang Gaoyang, director of Hongli Optoelectronics, this product uses printed phosphor coating technology and stencil printing solid crystal technology, both of which are patented by Hongli Optoelectronics. The product has the characteristics of small size and high power; the flip-chip package greatly reduces the design cost of the lamp, and the maximum angle of light emission is 145 degrees; the high power is more than 1W, and the light effect can be 120lm/W.
In the context of the industry's generally dilute profits in the packaging industry, it is not easy for Hongli Optoelectronics to achieve such results. "LED packaging is the core business of Hongli, especially in the field of white light devices." Liu Yusheng, executive vice president of Hongli Optoelectronics, said that although the overall packaging capacity of Hongli is not the largest in the industry, in terms of high-end white light devices, the scale should be domestic. The biggest.
Reliance General Manager of Hongli Optoelectronics took the stage to receive the award
The relevant data also shows that in 2013, the revenue of Hongli Optoelectronics packaging business exceeded the 500 million yuan mark, and the revenue of white light packaging business accounted for 421 million yuan, and the advantages of its white-light packaged devices are very obvious.
In October of this year, Hongli Optoelectronics spent a total of 170 million yuan to acquire a 100% stake in Smect. Hongli Optoelectronics not only acquired the high-quality assets and management team of Smex, but also cooperated with Sima in technology, customers and sales channels. They must complement each other and exert synergy to establish their leading position in the field of white light packaging.
Earlier in August, Hongli Optoelectronics announced that it had invested 1 billion yuan to establish an industrial park in Nanchang, which is mainly used for research and development, production and sales of LED packaging devices and LED lighting applications. The construction of this industrial base is self-evident for Hongli Optoelectronics to expand its production capacity, improve the cost performance of its products, and enhance its competitiveness and profitability.
In addition, Hongli Optoelectronics is also actively expanding its business areas to seek new profit growth points. In addition to strategic cooperation with Qingdao Jiesheng in June to enter the UV UV-LED market, Hongli Optoelectronics has achieved very good results in many key packaging technologies such as SMD, backlight devices, high-power devices, COB, and flip-chip packages. Results.
In recent years, the concept of flip-chip devices has been heated up, and Hongli Optoelectronics has also invested in it. In the 2014 High-tech LED Golden Globe Awards (5th), Hongli Optoelectronics relied on the X-CHIP high-heat-conducting small-size ceramic series flip-chip device to force the finalists into the top three. , Jingke Electronics) won the Golden Globe Award trophy for flip-chip devices.
According to Wang Gaoyang, director of Hongli Optoelectronics, this product uses printed phosphor coating technology and stencil printing solid crystal technology, both of which are patented by Hongli Optoelectronics. The product has the characteristics of small size and high power; the flip-chip package greatly reduces the design cost of the lamp, and the maximum angle of light emission is 145 degrees; the high power is more than 1W, and the light effect can be 120lm/W.
(Flip-chip device category Golden Globe Award winner: Hongli Optoelectronics; nominated finalists: Guangmai Electronics, Jingke Electronics)
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