Twelve steps to understand the manufacturing process of LED chips

The fabrication process of the LED chip can be divided into twelve steps.

LED chip inspection

Microscopic examination: Whether there is mechanical damage on the surface of the material and whether the size and electrode size of the lockhill chip and the electrode size meet the requirements of the process are complete.

2.LED expansion

Since the LED chip is still arranged with a small close spacing (about 0.1 mm) after dicing, it is not conducive to the operation of the post process. The film of the bonded chip is expanded by a spreader to stretch the pitch of the LED chip to about 0.6 mm. It can also be manually expanded, but it is easy to cause problems such as chip falling waste.

3.LED dispensing

Place silver glue or insulating glue on the corresponding position of the LED bracket. For GaAs, SiC conductive substrates, red, yellow, and yellow-green chips with back electrodes are made of silver paste. For blue and green LED chips of sapphire insulated substrates, insulating glue is used to fix the chips.

The difficulty of the process lies in the control of the amount of glue, and there are detailed technical requirements in the height of the glue and the position of the glue. Since silver glue and insulating glue have strict requirements in storage and use, the wake-up, stirring and use time of silver glue are all matters that must be paid attention to in the process.

4.LED preparation glue

In contrast to dispensing, the glue is applied to the back electrode of the LED with a glue machine, and then the LED with silver glue on the back is mounted on the LED holder. The efficiency of the preparation glue is much higher than that of the dispensing, but not all products are suitable for the preparation process.

5.LED hand-piercing

The expanded LED chip (with or without glue) is placed on the jig of the lancet table, and the LED holder is placed under the clamp, and the LED chips are punctured one by one under the microscope with a needle. Hand-made thorns have an advantage over automatic loading, making it easy to replace different chips at any time, for products that require multiple chips.

6.LED automatic mounting

The automatic loading is actually a combination of two steps of glue (dispensing) and mounting the chip. First, put silver glue (insulating glue) on the LED bracket, then use the vacuum nozzle to suck the LED chip to the moving position, and then place it in the The corresponding bracket position. In the process of automatic loading, the equipment should be familiar with the operation and programming of the equipment, and at the same time adjust the glue and installation accuracy of the equipment. In the selection of the nozzle, the bakelite nozzle should be used as much as possible to prevent damage to the surface of the LED chip. In particular, the blue and green chips must be made of bakelite. Because the steel nozzle will scratch the current diffusion layer on the surface of the chip.

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