Matsushita Electric Showcases Epitaxial Chip-Level Bonded Four-Layer Package LED New Products


Recently, Matsushita Electric exhibited the latest development of epitaxial wafer-level packaging (WLP) at the 20th Micromachine/MEMS Exhibition. Epitaxial wafers with epitaxial wafers and epitaxial wafers equipped with photosensors A total of four epitaxial wafers are integrated for packaging.

The package assembly includes a heat sink epitaxial wafer of RGB LEDs, a light reflecting epitaxial wafer that reflects light in a front direction, a light monitoring epitaxial wafer equipped with a sensor (for sensing LED light), and a light extraction epitaxial wafer with dual functions of light diffusion. The heat sink epitaxial wafer uses the via wiring to remove heat from the bottom of the package.

The illumination system arranged by the array of elements can sense the LED light through the light monitor, and feedback control the brightness of the LED, so that light with uniform color and brightness can be emitted, and the color and brightness can be arbitrarily set.
(Edit: Sandwich)

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