NXP introduces ultra-thin lead-free package ESD protection EMI filter

Portable devices can be used in a variety of environments, so products need to be rugged. Electrostatic discharge (ESD) refers to the situation in which stored static electricity is released to surrounding electronic equipment through invisible lines. Electrostatic discharge can occur at any time when the device is touched, and is exposed to dry air such as cold air or in an air-conditioned environment.

Portable devices are also susceptible to electromagnetic interference (EMI), such as interference from strong sources of interference such as 2G/3G handsets, WLAN or Bluetooth. Therefore, it is necessary for portable devices to install EMI filters to suppress interference frequencies and achieve trouble-free operation. It should be noted that the interference frequency is not necessarily generated by the mobile device itself. If the mobile phone and Other mobile devices are put together, the mobile phone will also generate interference frequency.

At present, NXP has introduced an ultra-thin leadless package, which is a solution that combines ESD protection and EMI filtering. The solution is highly integrated, simplifying cabling and making design easier. The high integration of the solution will greatly expand the application range of the product, not only reduce the board space, simplify the design, shorten the design cycle, but also reduce the hidden cost of the discrete solution in the production inspection, such as production line injection, feeding Check the cost.

The ESD protection solution for ambient temperature is tested against the IEC61000-4-2 standard. According to the IEC61000-4-2 standard, NXP's ESD protection solution has a maximum contact discharge protection voltage of up to 30kV, exceeding the highest level 4 protection voltage (8kV contact discharge) in the standard. The NXP solution also filters EMI emissions from 800MHz-3GHz handset frequencies with a maximum insertion loss of 30dB.

NXP's leadless package solutions use an industry-standard 0.4mmPin pitch and a thickness of no more than 0.5mm, which is in line with the trend toward lighter to thinner portable electronics. NXP offers 1/2/4/6/8 channel filters. All NXP solutions are based on the "DarkGreen" standard and are further halogen-free and flawless on the basis of RoHS compliance.

NXP's 30dBEMI filtering and 30kVESD protection integrated solution will protect your communications products.

Main application: Provides EMI/RFI filtering and ESD protection in mobile and portable applications.

*Camera interface

*Display and LCD interface

* Memory card interface (SD, MMC, etc.)

*Touch screen or keyboard interface

*Substrate connector

main features:

*800MHz-3GHz mobile phone frequency insertion loss up to 30dB

*ESD protection voltage is higher than IEC61000-4-2 level 4 standard

*Supply of 1/2/4/6/8 channel filters available

* DarkGreen standard (RoHS-compliant and halogen-free, flawless)

* Ultra-thin leadless package, thickness less than 0.5mm

*Pin spacing 0.4mm

The picture shows the clamp voltage of IP4254CZ16-8 under IEC61000-4-2, 4-level pulse ±8kV. The product integrates a TT-type filter (CRC structure) to ensure excellent ESD pulse transient response.

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