Model NO.: B0C-85
Condition: New
Board Thickness: 0.2-3.2mm
Copper Thickness: 0.18mm
Surface Finishing: Spray Tin, Gold-Plated, Immersion Gold
Min. Hole Size: 0.25mm
Trademark: brain-power
Transport Package: Dust Bag and Bubble Bag
Specification: CE, ISO
Origin: China(Mainland)
HS Code: 8534001000
About us:Our company was established in 1992 with about 3,000 employees,total land area up to 101,000m2, and floor area up to 81,000m2. We specialize in PCB manufacturing for more than 20 years.
With foresight management, we insist on "providing excellent quality products". We provide nearly error-free products and overall structured service in order to satisfy customer's needs.
| Â Â Â Â Â Â Â Item | 2015 | 2016E | |
| Mass Production | Sample | ||
| Max. Multilay ers | 20 | 20 | 24 |
| Board Thickness Tolerance (mil/mm) |
50±3mil / (±0.076mm); 14±2mil / (±0.05mm); | 50±3mil / (±0.076mm); 14±2mil / (±0.05mm); | |
| Min. hole size (mil) | Mechanical 6mil (0.15 mm), Laser 4mil (0.10 mm) |
Mechanical 6mil (0.15 mm), Laser 4mil (0.10 mm) |
Mechanical 6mil (0.15 mm), Laser 3.5mil (0.089 mm) |
| Finished Aspect ratio | 12:1. | 12:1. | 16:1. |
| Min. line Width/Space (mil) | 2.0/2.0mil; (0.050/0.050 mm) | 2.0/2.0mil; (0.050/0.050 mm) | 1.6/1.6mil;(0.040/0.040mm) |
| Impedance (ohm) | +/-10% | +/-10% | +/-7% |
| Dif f erential Impedance (ohm) | +/-10% | +/-10% | +/-7% |
| Gold Finger thickness(u"/um) | 80u" (2um) | 80u" (2um) | 80u" (2um) |
| Router tolerance | ±3.0mil (0.076mm) | ±3.0mil (0.076mm) | ±2.0mil (0.051mm) |
| Surface treatment | ENIG,H/G plating,OSP,Immersion sliver | ENIG,H/G plating,OSP,Immersion sliv er,Immersion Tin,ENEPIG |
|
| Application / Lamination | |||
| Standard and extended | FR4(TG140-180°),ANTI-CAF,Halogen Free, Low z-axis expansion(Lead Free) | ||
| Special perf ormance | High TG(BT) | High TG(BT),Low loss,FPCB material | |
| High f requency | PTFE,Ceramic | ||
What products and services we offer:
Excepting OEM PCB, i.e. Telecommunication, PC Add-On Card, IT Application, Network Device, Multi Layers FR-4 product, we have some outstanding products as follows:
1. Carbon Built on PCB:Apply for Thick Film Technology to make the PCB with buried resistors or touch pad function.
2. Thin PCB:Less than 16 mil thickness in 4 or 6 layers FR-4 production is another challenge for our production capability.
3. CSP // BGA PCB:Those kinds of PCB are increasing and we expect the quantity will be over 10% of our production in coming years.
4. Special Service: In addition to devote in normal PCB process, our engineering team also provide design support as requested by clients
Brain Power's Strength:
Excellent quality stability.
Excellent process and handling control.  (Thus impedance yield can achieve to 98% !)
High customer satisfaction.
Thin Board Production with 2 mils core.
Different Impedance technique leader in the RAM module market.
Tight board thickness tolerance(+/- 3 mils) control.
 Before quote, please offer:
- Gerber file
- Base material:Â FR4/ AL/ FPC/ CEM-1/ CEM-3/ 94v0/ Rogers
- Board thickness
- Surface treatment
- Copper thickness
- Color of solder mask and silkscreen        Â
Shenyang Haimeng Lighting Co. , http://www.hmwled.com