TSMC's (2330-TW) (TSM-US) capital expenditures for this year (2011) will reach 7.8 billion U.S. dollars, an increase of 31.4% year-on-year, mainly to improve the competitiveness of research and development, the company also announced after the closure of the year, start 18-inch wafers. The plant investment plan is expected to be introduced into the trial production line in 2013 and mass production will start in 20nm in 2015.
Due to strong demand from advanced process customers, TSMC also pointed out that lowering customer costs can increase product competitiveness and increase the relative customer order volume, further consolidating TSMC’s market share. Therefore, TSMC is the first to start an 18-inch wafer fab investment plan, which is expected to be imported at 20nm. The process technology will surpass Intel’s 22nm, and it will become the second largest semiconductor company in the world after Intel’s investment in 18-inch plants. .
In addition, TSMC has expanded its partnership with CSR, a leading manufacturer of wireless connectivity, positioning and audio platforms. CSR has adopted TSMC's advanced 90nm embedded flash memory technology, Zhi Zhicai and RF CMOS process to launch a new generation of wireless products. Compared with the previous generation of 0.18-micron process technology, it is twice as fast as Nintek, which is in line with the needs of applications such as portable communications, smart cards, and high-speed microcontrollers.
Chen Junsheng, senior deputy general manager of global business and marketing at TSMC, pointed out that the technical cooperation with CSR is an example of TSMC's commitment to promoting European logic IC innovation. TSMC's 90nm embedded flash memory process technology and Yu Zhicai support are highly effective. Energy, low power and high density memory, together with our RF CMOS process, assisted CSR in the launch of next-generation system single-chip products.
Chris Ladas, executive vice president of CSR operations, emphasized that CSR and TSMC's close cooperation in this 90-nm embedded flash memory process technology has enabled CSR to maintain leadership in developing a flexible, highly integrated SoC platform for consumer electronics audio applications. Provide outstanding system performance and competitive advantage in the smallest size.
Due to strong demand from advanced process customers, TSMC also pointed out that lowering customer costs can increase product competitiveness and increase the relative customer order volume, further consolidating TSMC’s market share. Therefore, TSMC is the first to start an 18-inch wafer fab investment plan, which is expected to be imported at 20nm. The process technology will surpass Intel’s 22nm, and it will become the second largest semiconductor company in the world after Intel’s investment in 18-inch plants. .
In addition, TSMC has expanded its partnership with CSR, a leading manufacturer of wireless connectivity, positioning and audio platforms. CSR has adopted TSMC's advanced 90nm embedded flash memory technology, Zhi Zhicai and RF CMOS process to launch a new generation of wireless products. Compared with the previous generation of 0.18-micron process technology, it is twice as fast as Nintek, which is in line with the needs of applications such as portable communications, smart cards, and high-speed microcontrollers.
Chen Junsheng, senior deputy general manager of global business and marketing at TSMC, pointed out that the technical cooperation with CSR is an example of TSMC's commitment to promoting European logic IC innovation. TSMC's 90nm embedded flash memory process technology and Yu Zhicai support are highly effective. Energy, low power and high density memory, together with our RF CMOS process, assisted CSR in the launch of next-generation system single-chip products.
Chris Ladas, executive vice president of CSR operations, emphasized that CSR and TSMC's close cooperation in this 90-nm embedded flash memory process technology has enabled CSR to maintain leadership in developing a flexible, highly integrated SoC platform for consumer electronics audio applications. Provide outstanding system performance and competitive advantage in the smallest size.
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