Causes of electrical erosion during segmentation

Relays are the control components of automotive electrical systems and the key to the normal operation of electrical systems. With the continuous increase of auxiliary functions, the number of them continues to increase, and the requirements for contacts also increase. The working characteristics of automotive relays are low-voltage DC, which requires switching on and off various loads, such as lamp loads, motor loads, and resistive loads. At present, automobile relay contacts have the disadvantages of large volume, high silver consumption, serious directional transfer of materials under the action of DC arc, and easy fusion welding under the impact of instantaneous large current, which affects the reliable operation of electrical systems.

Therefore, from the perspective of the system, the contact body as a whole is used to improve the structure and material of the contact body from the inside; from the outside, the power electronic technology is used to control the contact to improve the switching ability of the automotive relay and reduce the volume ,lower the cost. The load of the resistor is mostly the resistance of the winding structure. In addition to a certain resistance, there is also a certain inductance. Therefore, although a large inrush current does not occur when the contact is connected to the resistor load, it is difficult to extinguish the arc generated when it is broken. Therefore, the electrical erosion caused by breaking is more serious than the lamp load.

The motor load in the car includes a starter and various servo motors. The inrush current is large when starting. When the contact is connected to this load, if a second bounce occurs, it will cause serious electrical erosion. In the breaking process, due to the large inductance value of the motor load, the long arcing time, and the difficulty of extinguishing the arc, the arc erosion is the most serious. In summary, under the light load condition of automotive relay contacts, the welding process and material transfer are likely to occur during the connection process. Therefore, the suppression of contact bounce and the reduction of material transfer are the key issues in research.

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